The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Aug. 29, 2017
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

David Fraser Rae, San Diego, CA (US);

Hong Bok We, San Diego, CA (US);

Christopher Healy, San Diego, CA (US);

Chin-Kwan Kim, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/552 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/3205 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/32051 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/13 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/81 (2013.01); H01L 23/367 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/94 (2013.01); H01L 2224/96 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A package that includes an integrated device partially enclosed in a conductive material and embedded in a package substrate. The package includes a package substrate having a first cavity, the integrated device having a first active side and an inactive side embedded in the first cavity, and a structure partially enclosing the integrated device having a first layer and a second layer, wherein the first layer is coupled between the package substrate and the integrated device, and wherein the second layer is disposed over the inactive side of the integrated device.


Find Patent Forward Citations

Loading…