The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Jul. 20, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Xiang Li, Singapore, SG;

Shao-Hui Wu, Singapore, SG;

Hsiao Yu Chia, Singapore, SG;

Yu-Cheng Tung, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 21/465 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66969 (2013.01); H01L 21/465 (2013.01); H01L 29/7869 (2013.01);
Abstract

A manufacturing method of an oxide semiconductor device includes the following steps. A first oxide semiconductor layer is formed on a substrate. A gate insulation layer is formed on the first oxide semiconductor layer. A first flattening process is performed on a top surface of the first oxide semiconductor layer before the step of forming the gate insulation layer. A roughness of the top surface of the first oxide semiconductor layer after the first flattening process is smaller than the roughness of the top surface of the first oxide semiconductor layer before the first flattening process.


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