The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Nov. 16, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Hsin-Che Chiang, Taipei, TW;

Ju-Yuan Tzeng, New Taipei, TW;

Chun-Sheng Liang, Changhua County, TW;

Shu-Hui Wang, Hsinchu, TW;

Kuo-Hua Pan, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/40 (2006.01); H01L 29/51 (2006.01); H01L 29/78 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01); H01L 21/3115 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66545 (2013.01); H01L 21/0228 (2013.01); H01L 21/02183 (2013.01); H01L 21/02321 (2013.01); H01L 21/28088 (2013.01); H01L 21/3115 (2013.01); H01L 29/401 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01); H01L 29/78 (2013.01);
Abstract

A method of forming a gate structure of a semiconductor device including depositing a high-k dielectric layer over a substrate is provided. A dummy metal layer is formed over the high-k dielectric layer. The dummy metal layer includes fluorine. A high temperature process is performed to drive the fluorine from the dummy metal layer into the high-k dielectric layer thereby forming a passivated high-k dielectric layer. Thereafter, the dummy metal layer is removed. At least one work function layer over the passivated high-k dielectric layer is formed. A fill metal layer is formed over the at least one work function layer.


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