The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

May. 23, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sung-Gil Kim, Yongin-si, KR;

Seul-Ye Kim, Seoul, KR;

Hong-suk Kim, Yongin-si, KR;

Phil-Ouk Nam, Suwon-si, KR;

Jae-Young Ahn, Seongnam-si, KR;

Ji-Hoon Choi, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/792 (2006.01); H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/31111 (2013.01); H01L 21/7685 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 27/11556 (2013.01);
Abstract

A semiconductor device may include a plurality of conductive patterns and an insulation pattern. The plurality of conductive patterns may be formed on a substrate. The plurality of conductive patterns may be spaced apart from each other in a vertical direction perpendicular to an upper surface of the substrate. Each of the plurality of conductive patterns may have an extension portion and a step portion. The step portion may be disposed at an edge of the corresponding conductive pattern. The insulation pattern may be formed between the plurality of conductive patterns in the vertical direction. A lower surface and an upper surface of the step portion of each of the plurality of conductive patterns may be bent upwardly.


Find Patent Forward Citations

Loading…