The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Sep. 11, 2017
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Kenya Ito, Tokyo, JP;
Masaya Seki, Tokyo, JP;
Kenichi Kobayashi, Tokyo, JP;
Michiyoshi Yamashita, Tokyo, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); B23K 26/08 (2014.01); B24B 37/00 (2012.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); B24B 21/00 (2006.01); B24B 21/08 (2006.01); B24B 9/06 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3043 (2013.01); B23K 26/0823 (2013.01); B24B 9/065 (2013.01); B24B 21/002 (2013.01); B24B 21/004 (2013.01); B24B 21/08 (2013.01); B24B 37/00 (2013.01); H01L 21/02021 (2013.01); H01L 21/304 (2013.01); H01L 21/67138 (2013.01); B23K 2101/40 (2018.08);
Abstract
A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.