The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Mar. 08, 2016
Tohoku University, Sendai-shi, Miyagi, JP;
Soshi Sato, Sendai, JP;
Masaaki Niwa, Sendai, JP;
Hiroaki Honjo, Sendai, JP;
Shoji Ikeda, Sendai, JP;
Hideo Ohno, Sendai, JP;
Tetsuo Endo, Sendai, JP;
TOHOKU UNIVERSITY, Sendai-shi, Miyagi, JP;
Abstract
A method of manufacturing a spintronics element from laminated layers. The method includes (a) forming a plurality of laminated layers in manufacturing equipment, (b) forming a wafer in the manufacturing equipment, including applying a protection layer directly on a non-magnetic uppermost layer of the laminated layers so that the protection layer prevents alteration of characteristics of the uppermost layer, and (c) exposing the wafer, outside of the manufacturing equipment, to an atmosphere that includes HO having a partial pressure in the atmosphere equal to or larger than 10Pa.