The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Nov. 25, 2010
Vijay Immanuel Raman, Mannheim, DE;
Sophia Ebert, Mannheim, DE;
Mario Brands, Ludwigshafen, DE;
Yongqing Lan, Potsdam, NY (US);
Philipp Zacharias, Mannheim, DE;
Ilshat Gubaydullin, Ludwigshafen, DE;
Yuzhuo LI, Heidelberg, DE;
Vijay Immanuel Raman, Mannheim, DE;
Sophia Ebert, Mannheim, DE;
Mario Brands, Ludwigshafen, DE;
Yongqing Lan, Potsdam, NY (US);
Philipp Zacharias, Mannheim, DE;
Ilshat Gubaydullin, Ludwigshafen, DE;
Yuzhuo Li, Heidelberg, DE;
BASF SE, Ludwigshafen, DE;
Abstract
A process for removing a bulk material layer from a substrate and planarizing the exposed surface by CMP by (1) providing an CMP agent exhibiting at the end of the chemical mechanical polishing, without the addition of supplementary materials, the same SER as at its start and a lower MRR than at its start, —an SER which is lower than the initial SER and an MRR which is the same or essentially the same as the initial MRR or a lower SER and a lower MRR than at its start; (2) contacting the surface of the bulk material layer with the CMP agent; (3) the CMP of the bulk material layer with the CMP agent; and (4) continuing the CMP until all material residuals are removed from the exposed surface; and a CMP agent and their use for manufacturing electrical and optical devices.