The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
Mar. 11, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Toyohiro Aoki, Kanagawa, JP;
Akihiro Horibe, Kanagawa-ken, JP;
Kuniaki Sueoka, Kanagawa-ken, JP;
Kazushige Toriyama, Kyoto, JP;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B23K 3/06 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); B23K 3/0607 (2013.01); B23K 3/0638 (2013.01); H01L 21/486 (2013.01); H01L 21/67103 (2013.01); H01L 21/67138 (2013.01); H01L 21/68757 (2013.01);
Abstract
A method for filling a through hole with solder includes mounting a substrate having a through hole formed therein on a permeable barrier layer having pores that enable gas to flow through the permeable barrier. A solder source is positioned over the through hole. Molten solder is delivered in the through hole with a positive pressure from the solder source such that gas in the through holes passes the permeable barrier while the molten solder remains in the through hole.