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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10388559 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Sep. 23, 2016

Apparatus for depositing a layer on a substrate in a processing gas

Applicant:

Evatec Ag, Trubbach, CH;

Inventors:

Sven Uwe Rieschl, Malans, CH;

Mohamed Elghazzali, Feldkirch, AT;

Jurgen Weichart, Balzers, LI;

Assignee:

EVATEC AG, Trübbach, CH;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Joseph A Miller, Jr

Int. Cl.
CPC ...
H01L 21/687 (2006.01); C23C 14/50 (2006.01); C23C 14/54 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); H01L 21/285 (2006.01); H01L 21/768 (2006.01); C23C 16/50 (2006.01); C23C 16/52 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68785 (2013.01); C23C 14/50 (2013.01); C23C 14/541 (2013.01); C23C 16/4585 (2013.01); C23C 16/4586 (2013.01); C23C 16/466 (2013.01); C23C 16/50 (2013.01); C23C 16/52 (2013.01); H01J 37/32715 (2013.01); H01J 37/347 (2013.01); H01J 37/3488 (2013.01); H01L 21/2855 (2013.01); H01L 21/67253 (2013.01); H01L 21/6833 (2013.01); H01L 21/68721 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01); H01L 21/68764 (2013.01); H01L 21/76838 (2013.01); H01L 21/76873 (2013.01); H01L 21/76879 (2013.01);
Abstract

Apparatus for depositing a layer on a substrate in a process gas includes a chuck containing a first surface for supporting the substrate, a clamp for securing the substrate to the first surface of the chuck, an evacuatable enclosure enclosing the chuck and the clamp and control apparatus. The evacuatable enclosure includes an inlet, through which the processing gas is insertable into the enclosure. The control apparatus is adapted to move at least one of the chuck and the clamp relative to, and independently of, one another to adjust a spacing between the chuck and the clamp during a single deposition process while maintaining a flow of the processing gas and a pressure within the enclosure that is less than atmospheric pressure.

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