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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10388537 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Feb. 09, 2017

Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Chae Lyoung Kim, Hwaseong-si, KR;

Tae-Hong Kim, Seoul, KR;

Jung-Min Oh, Incheon, KR;

Yungjun Kim, Seoul, KR;

Ingi Kim, Hwaseong-si, KR;

Boun Yoon, Seoul, KR;

Hyosan Lee, Hwaseong-si, KR;

Sol Han, Gyeonggi-do, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Shamim Ahmed

Int. Cl.
CPC ...
B08B 3/02 (2006.01); H01L 21/306 (2006.01); B24B 37/20 (2012.01); B24B 53/017 (2012.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30625 (2013.01); B24B 37/20 (2013.01); B24B 53/017 (2013.01); H01L 21/02057 (2013.01); H01L 21/02065 (2013.01); H01L 21/02074 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/67173 (2013.01); H01L 21/67219 (2013.01);
Abstract

A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.

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