The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Jul. 12, 2017
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 37/10 (2012.01); B24B 37/30 (2012.01); B08B 1/04 (2006.01); B24B 37/04 (2012.01); H01L 21/687 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01); B24B 27/033 (2006.01); B24B 41/06 (2012.01); B24B 49/08 (2006.01); B24D 7/06 (2006.01); B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
B08B 1/04 (2013.01); B24B 7/228 (2013.01); B24B 27/033 (2013.01); B24B 37/013 (2013.01); B24B 37/042 (2013.01); B24B 37/10 (2013.01); B24B 37/107 (2013.01); B24B 37/30 (2013.01); B24B 41/067 (2013.01); B24B 49/08 (2013.01); B24D 7/06 (2013.01); H01L 21/304 (2013.01); H01L 21/67051 (2013.01); H01L 21/6875 (2013.01); H01L 21/68728 (2013.01);
Abstract
An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.