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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10375825 B1

PDFFull Text
Date of Patent:
Aug. 06, 2019

Filed:

Oct. 10, 2016

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Nobuyuki Terasaki, Saitama, JP;

Yoshiyuki Nagatomo, Saitama, JP;

Kimihito Nishikawa, Gotenba, JP;

Yoshirou Kuromitsu, Saitama, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorney:

Locke Lord LLP

Primary Examiner:

Archene A Turner

Int. Cl.
CPC ...
H05K 1/02 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 35/32 (2006.01); C22C 5/06 (2006.01); C22C 14/00 (2006.01); C22C 16/00 (2006.01); C22C 21/00 (2006.01); C22C 27/00 (2006.01); C22C 27/02 (2006.01); C22C 28/00 (2006.01); C22F 1/08 (2006.01); H01L 23/373 (2006.01); B23K 1/00 (2006.01); B23K 35/36 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/38 (2006.01); H05K 13/04 (2006.01); C04B 37/02 (2006.01); C04B 35/632 (2006.01); B23K 35/26 (2006.01); B23K 35/365 (2006.01); C22C 30/04 (2006.01); G01B 15/02 (2006.01); G01N 23/203 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B23K 1/0008 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/262 (2013.01); B23K 35/30 (2013.01); B23K 35/3006 (2013.01); B23K 35/32 (2013.01); B23K 35/36 (2013.01); B23K 35/365 (2013.01); C04B 35/632 (2013.01); C04B 37/025 (2013.01); C04B 37/026 (2013.01); C22C 5/06 (2013.01); C22C 14/00 (2013.01); C22C 16/00 (2013.01); C22C 21/00 (2013.01); C22C 27/00 (2013.01); C22C 27/02 (2013.01); C22C 28/00 (2013.01); C22C 30/04 (2013.01); C22F 1/08 (2013.01); G01B 15/02 (2013.01); G01N 23/203 (2013.01); H01L 23/3735 (2013.01); H05K 1/0203 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 3/388 (2013.01); H05K 13/0465 (2013.01); B23K 2101/42 (2018.08); C04B 2235/44 (2013.01); C04B 2237/08 (2013.01); C04B 2237/121 (2013.01); C04B 2237/122 (2013.01); C04B 2237/124 (2013.01); C04B 2237/125 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/128 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/402 (2013.01); C04B 2237/407 (2013.01); C04B 2237/60 (2013.01); C04B 2237/704 (2013.01); C04B 2237/706 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); G01N 2223/633 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01322 (2013.01); H05K 2201/0175 (2013.01); Y10T 428/12542 (2015.01);
Abstract

This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate; a nitride layerthat is formed on the surface of the ceramic substratebetween the copper plate and the ceramic substrate; and an Ag—Cu eutectic structure layerhaving a thickness of 15 μm or less that is formed between the nitride layer and the copper plate.

Find Patent Forward Citations

Terasaki, Nobuyuki. (2019). Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste (U.S. Patent No. 10375825). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10375825

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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