The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Mar. 29, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Souk Kim, Seoul, KR;

Chung-sam Jun, Suwon-si, KR;

Woo-seok Ko, Seoul, KR;

Sang-kil Lee, Yongin-si, KR;

Kwang-il Shin, Suwon-si, KR;

Yu-sin Yang, Seoul, KR;

Min-chul Yoon, Incheon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/20 (2006.01); H01J 37/22 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
H01J 37/222 (2013.01); H01J 37/20 (2013.01); H01J 37/28 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/226 (2013.01); H01J 2237/2817 (2013.01);
Abstract

A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning the respective partial regions of each of the plurality of dies by using the electron beam columns; and combining a plurality of partial images that are obtained by scanning the partial regions to provide a die image.


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