The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Nov. 28, 2017
Applicant:

Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;

Inventors:

Chun-Hsien Yu, Hsinchu County, TW;

Hsien-Ming Tsai, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 21/4825 (2013.01); H01L 23/3121 (2013.01); H05K 1/0209 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/181 (2013.01); H05K 2201/066 (2013.01);
Abstract

The present disclosure provides an electronic package, including a package substrate and an electronic component formed on the package substrate. The substrate includes an insulating portion, a wiring portion embedded in the insulating portion, and a metal board disposed on the insulating portion and in contact with the wiring portion. The metal board is provided with a plurality of electrical contacts and a heat dissipating portion. The metal board can maintain a predefined heat dissipation area via the heat dissipating portion, and be connected to a circuit board via the electrical contacts.


Find Patent Forward Citations

Loading…