The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Jan. 24, 2018
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Tsung-Che Tsai, Essex Junction, VT (US);

Alain F. Loiseau, Williston, VT (US);

Robert J. Gauthier, Jr., Williston, VT (US);

Souvick Mitra, Essex Junction, VT (US);

You Li, South Burlington, VT (US);

Mickey H. Yu, Essex Junction, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/74 (2006.01); H01L 29/868 (2006.01); H01L 23/535 (2006.01); H01L 21/761 (2006.01); H01L 29/66 (2006.01); H01L 21/768 (2006.01); H01L 29/06 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7416 (2013.01); H01L 21/761 (2013.01); H01L 21/76895 (2013.01); H01L 23/535 (2013.01); H01L 29/0646 (2013.01); H01L 29/66371 (2013.01); H01L 29/868 (2013.01); H01L 27/0262 (2013.01);
Abstract

Disclosed is an integrated circuit (IC) structure that incorporates a string of vertical devices. Embodiments of the IC structure include a string of two or more vertical diodes. Other embodiments include a vertical diode/silicon-controlled rectifier (SCR) string and, more particularly, a diode-triggered silicon-controlled rectifier (VDTSCR). In any case, each embodiment of the IC structure includes an N-well in a substrate and, within that N-well, a P-doped region and an N-doped region that abuts the P-doped region. The P-doped region can be anode of a vertical diode and can be electrically connected to the N-doped region (e.g., by a local interconnect or by contacts and metal wiring) such that the vertical diode is electrically connected to another vertical device (e.g., another vertical diode or a SCR with vertically-oriented features). Also disclosed is a manufacturing method that can be integrated with methods of manufacturing vertical field effect transistors (VFETs).


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