The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Feb. 28, 2018
Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Kurt Wostyn, Lubbeek, BE;

Hans Mertens, Leuven, BE;

Liesbeth Witters, Lubbeek, BE;

Andriy Hikavyy, Haasrode, BE;

Naoto Horiguchi, Leuven, BE;

Assignee:

IMEC VZW, Leuven, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/66 (2006.01); B82Y 40/00 (2011.01); H01L 21/8234 (2006.01); H01L 29/08 (2006.01); B82Y 10/00 (2011.01); H01L 29/417 (2006.01); H01L 29/775 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0653 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); H01L 21/823425 (2013.01); H01L 29/0669 (2013.01); H01L 29/0673 (2013.01); H01L 29/0847 (2013.01); H01L 29/41725 (2013.01); H01L 29/6653 (2013.01); H01L 29/6681 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/66553 (2013.01); H01L 29/775 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01);
Abstract

A method of forming an internal spacer between nanowires, the method involving: providing a fin comprising a stack of layers of sacrificial material alternated with nanowire material, and selectively removing part of the sacrificial material, thereby forming a recess. The method also involves depositing dielectric material into the recess resulting in dielectric material within the recess and excess dielectric material outside the recess, where a crevice remains in the dielectric material in each recess, and removing the excess dielectric material using a first etchant. The method also involves enlarging the crevices to form a gap using a second etchant such that a remaining dielectric material still covers the sacrificial material and partly covers the nanowire material, and such that outer ends of the nanowire material are accessible; and growing electrode material on the outer ends such that the electrode material from neighboring outer ends merge, thereby covering the gap.


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