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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10361162 B1

PDFFull Text
Date of Patent:
Jul. 23, 2019

Filed:

Jan. 23, 2018

Magnetic shielding of stt-mram in multichip packaging and method of manufacturing the same

Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Bharat Bhushan, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Boo Yang Jung, Singapore, SG;

Wanbing Yi, Singapore, SG;

Danny Pak-Chum Shum, Singapore, SG;

Assignee:

GLOBALFOUNDRIES SINGAPORE PTE. LTD., Singapore, SG;

Attorney:

Ditthavong & Steiner, P.C.

Primary Examiner:

Minh Loan Tran

Int. Cl.
CPC ...
H01L 23/552 (2006.01); G11C 11/16 (2006.01); H01L 27/22 (2006.01); H01L 25/16 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); G11C 11/161 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/485 (2013.01); H01L 25/16 (2013.01); H01L 27/222 (2013.01);
Abstract

Methodologies and an apparatus for enabling magnetic shielding of stand alone MRAM are provided. Embodiments include placing MRAM dies and logic dies on a first surface of a mold frame; forming a top magnetic shield over top and side surfaces of the MRAM dies; forming a mold cover over the MRAM dies, FinFET dies and mold frame; removing the mold frame to expose a bottom surface of the MRAM dies and FinFET dies; and forming a bottom magnetic shield over the bottom surface of the MRAM dies.

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