The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
Apr. 27, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Chang-Woo Sun, Hwaseong-si, KR;
Ji-Eun Yun, Hwaseong-si, KR;
Jae-Soon Lim, Seoul, KR;
Youn-Joung Cho, Hwaseong-si, KR;
Myong-Woon Kim, Daejeon, KR;
Kang-Yong Lee, Daejeon, KR;
Sang-Ick Lee, Daejeon, KR;
Sung-Woo Cho, Daegu, KR;
Assignees:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
DNF Co. Ltd., Daejon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); C07F 11/00 (2006.01); H01L 21/285 (2006.01); C07F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76841 (2013.01); C07F 11/00 (2013.01); C07F 17/00 (2013.01); H01L 21/28562 (2013.01);
Abstract
An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.