The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Jul. 11, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Ravichander Rao, Bangalore, IN;

Gary Taan, San Jose, CA (US);

Andreas Russ, Brooktondale, NY (US);

Bjorn Brauer, Beaverton, OR (US);

Roger Davis, Beaverton, OR (US);

Bryant Mantiply, Mountainview, CA (US);

Swati Ramanathan, Oakland, CA (US);

Karen Biagini, Watsonville, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01N 21/8851 (2013.01); G01N 2021/8887 (2013.01); G06T 2207/20056 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30164 (2013.01);
Abstract

Systems and methods for tool health monitoring and matching through integrated real-time data collection, event prioritization, and automated determination of matched states through image analysis are disclosed. Data from the semiconductor production tools can be received in real-time. A control limit impact (CLI) of the parametric data and the defect attributes data can be determined and causation factors can be prioritized. Image analysis techniques can compare images and can be used to judge tool matching, such as by identifying one of the states at which the two or more of the semiconductor manufacturing tools match.


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