The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Aug. 03, 2017
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Chuan-Yung Shih, Kaohsiung, TW;

Tai-Yuan Huang, Kaohsiung, TW;

Yu-Chi Wang, Kaohsiung, TW;

Chin-Feng Wang, Kaohsiung, TW;

Sing-Syuan Shiau, Kaohsiung, TW;

Chun-Wei Shih, Kaohsiung, TW;

Shao-Ci Huang, Kaohsiung, TW;

Huang-Hsien Chang, Kaohsiung, TW;

Yuan-Feng Chiang, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/458 (2006.01); H01L 21/285 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
C23C 16/458 (2013.01); H01L 21/67742 (2013.01); H01L 21/68785 (2013.01); H01L 21/0262 (2013.01); H01L 21/02271 (2013.01); H01L 21/28556 (2013.01);
Abstract

In one or more embodiments, an apparatus for processing a wafer includes a ceramic wall, a metal wall and a frame. The ceramic wall defines a chamber for accommodating the wafer. The ceramic wall has a first surface defining a first opening. The metal wall surrounds the ceramic wall. The metal wall has a second surface defining a second opening adjacent to the first opening. The frame covers the second surface.


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