Chun-Wei Shih

Title: Innovations by Chun-Wei Shih in Semiconductor Technology

Introduction

Chun-Wei Shih is a prominent inventor based in Kaohsiung, Taiwan, recognized for his contributions to semiconductor technology. He has been granted two patents that demonstrate his expertise and innovative approach within the field. His work plays a crucial role in advancing semiconductor packages, which are pivotal in modern electronic devices.

Latest Patents

Shih's most recent patents focus on enhancing the structural integrity and performance of semiconductor package designs. The first patent describes a substrate structure and semiconductor package structure. This invention outlines a substrate that consists of a first dielectric layer, a pad, and a conductive structure. Notably, the first dielectric layer features an opening that exposes the pad, designed with a width narrower than that of the pad itself. The conductive structure is strategically positioned on the pad, with its first portion extending outside the layer's opening while the second portion is integrated within the opening, maintaining an aspect ratio that exceeds 1.375.

The second patent details an apparatus for processing a wafer, which includes a ceramic wall, a metal wall, and a frame. The ceramic wall forms a chamber specifically for accommodating the wafer, with both walls defined by openings that enhance processing capabilities. This innovative design aims to enhance efficiency and reliability in semiconductor manufacturing.

Career Highlights

Chun-Wei Shih is currently associated with Advanced Semiconductor Engineering, Inc., a leading company in semiconductor technology. His role there has allowed him to develop and refine his inventions, contributing to significant advancements in the industry. His work not only showcases his innovative thinking but also reflects the ongoing evolution of semiconductor applications.

Collaborations

Throughout his career, Shih has collaborated with notable colleagues such as Chuan-Yung Shih and Tai-Yuan Huang. Working alongside these professionals has enabled him to combine expertise and share insights, further enriching the innovative landscape of semiconductor technology.

Conclusion

Chun-Wei Shih's contributions to the field of semiconductor technology through his innovative patents underscore the importance of continuous development within the electronics sector. His work remains influential in shaping the future of semiconductor packaging, thereby impacting various applications in modern technology.