The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Jun. 17, 2015
Applicant:
Fujimi Incorporated, Kiyosu-shi, Aichi, JP;
Inventors:
Assignee:
Fujimi Incorporated, Kiyosu-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C09G 1/02 (2006.01); B24B 37/00 (2012.01); C09K 3/14 (2006.01); B24B 37/24 (2012.01); H01L 21/02 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/00 (2013.01); B24B 37/044 (2013.01); B24B 37/24 (2013.01); C09K 3/14 (2013.01); H01L 21/02021 (2013.01); H01L 21/02024 (2013.01); H01L 21/02052 (2013.01); H01L 21/30625 (2013.01);
Abstract
Provided is a composition for polishing silicon wafers, having an excellent effect of reducing haze and having low agglomerating property. A composition for polishing silicon wafers provided here includes: an amido group-containing polymer A; and an organic compound B not containing an amido group. The amido group-containing polymer A has, on a main chain, a building block S derived from a monomer represented by General Formula (1). Molecular weight Mof the amido group-containing polymer A and molecular weight Mof the organic compound B have a relation satisfying 200≤M<M.