The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Jan. 20, 2017
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Robert M. Danen, San Jose, CA (US);
Shuo Sun, Fremont, CA (US);
Thomas Boatwright, Milpitas, CA (US);
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01); G06T 7/00 (2017.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01N 21/8851 (2013.01); G01N 21/9505 (2013.01); G06T 7/0004 (2013.01); H01L 22/20 (2013.01); G01N 2021/8887 (2013.01); G06T 2207/30148 (2013.01);
Abstract
Methods and systems for selecting optical modes suitable for defect inspection are disclosed. A method may include: scanning a full-stack wafer of the particular type utilizing a set of optical modes to obtain a set of full-stack wafer images; and de-processing the full-stack wafer to produce a de-processed wafer based on a location of a potential defect of interest indicated by the set of full-stack wafer images to facilitate selection of optical modes suitable for defect inspection of wafers of the particular type.