Reduced-dimension via-land structure and method of making the same

Abstract

A package substrate includes a dielectric layer, a conductive via disposed in the dielectric layer, and a conductive pattern layer exposed from a first surface of the dielectric layer. The conductive pattern layer includes traces and a via land, the via land extends into the conductive via, and a circumferential portion of the via land is encompassed by the conductive via. A method of making a package substrate includes forming a conductive pattern layer including traces and a via land, providing a dielectric layer to cover the conductive pattern layer, and forming a via hole. Forming the via hole is performed by removing a portion of the dielectric layer and exposing a bottom surface of the via land and at least a portion of a side surface of the via land. A conductive material is applied into the via hole to form a conductive via covering the via land.