The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Oct. 28, 2015
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); C04B 35/111 (2006.01); H01L 29/20 (2006.01); B32B 9/04 (2006.01); C04B 35/453 (2006.01); C04B 37/00 (2006.01); H03H 9/02 (2006.01); B32B 9/00 (2006.01); H01L 29/16 (2006.01); H01L 41/08 (2006.01); B32B 7/12 (2006.01); B32B 5/02 (2006.01); B32B 5/18 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); H01L 41/312 (2013.01); H01L 41/313 (2013.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 29/0649 (2013.01); B32B 5/022 (2013.01); B32B 5/18 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/04 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); C04B 35/111 (2013.01); C04B 35/453 (2013.01); C04B 37/00 (2013.01); C04B 37/001 (2013.01); C04B 37/005 (2013.01); C04B 37/008 (2013.01); H01L 29/16 (2013.01); H01L 41/08 (2013.01); H01L 41/081 (2013.01); H01L 41/312 (2013.01); H01L 41/313 (2013.01); H03H 9/02566 (2013.01); H03H 9/02574 (2013.01); H03H 9/02834 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0246 (2013.01); B32B 2262/0253 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/0276 (2013.01); B32B 2266/0278 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/786 (2013.01); C04B 2235/963 (2013.01); C04B 2237/062 (2013.01); C04B 2237/064 (2013.01); C04B 2237/08 (2013.01); C04B 2237/30 (2013.01); C04B 2237/34 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/36 (2013.01); C04B 2237/52 (2013.01); H01L 29/2003 (2013.01); H01L 33/007 (2013.01);
Abstract
A supporting substrate for a composite substrate comprises a ceramic and has a polished surface for use in bonding. An orientation degree of the ceramic forming the supporting substrate at the polished surface is 50% or higher, and an aspect ratio of each crystal grain included in the supporting substrate is 5.0 or less.