The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Dec. 09, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Andreas Wolter, Regensburg, DE;
Saravana Maruthamuthu, Munich, DE;
Mikael Knudsen, Gistrup, DK;
Thorsten Meyer, Regensburg, DE;
Georg Seidemann, Landshut, DE;
Pablo Herrero, Munich, DE;
Pauli Jaervinen, Wallerfing, DE;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01L 23/66 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01Q 1/50 (2006.01); H01Q 1/52 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4846 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01Q 1/38 (2013.01); H01Q 1/50 (2013.01); H01Q 1/526 (2013.01); H01L 23/295 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01);
Abstract
An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.