The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2019
Filed:
Mar. 23, 2017
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Ranga Rao Arnepalli, Veeravalli post, IN;
Prerna Goradia, Mumbai, IN;
Prayudi Lianto, Singapore, SG;
Jie Zeng, Singapore, SG;
Arvind Sundarrajan, Singapore, SG;
Robert Jan Visser, Menlo Park, CA (US);
Guan Huei See, Singapore, SG;
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3105 (2006.01); H01L 21/3205 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); C09G 1/00 (2006.01); C09G 1/04 (2006.01); C09G 1/06 (2006.01); C09K 13/06 (2006.01); B24B 1/00 (2006.01); B24B 37/04 (2012.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31058 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/02 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/1409 (2013.01); C09K 3/1436 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); H01L 21/30625 (2013.01); H01L 21/32051 (2013.01);
Abstract
A slurry for chemical mechanical planarization includes water, 1-3 wt. % of abrasive particles having an average diameter of at least 10 nm and less than 100 nm and an outer surface of ceria, and ½-3 wt. % of at least one amine.