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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10317932 B1

PDFFull Text
Date of Patent:
Jun. 11, 2019

Filed:

Jul. 02, 2016

Capacitive structures for crosstalk reduction

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Zhichao Zhang, Chandler, AZ (US);

Xiang Li, Portland, OR (US);

Kemal Aygun, Chandler, AZ (US);

Zhiguo Qian, Chandler, AZ (US);

Tolga Memioglu, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Grossman, Tucker, Perreault & Pfleger, PLLC

Primary Examiner:

Rockshana D Chowdhury

Int. Cl.
CPC ...
H05K 1/02 (2006.01); G11C 5/06 (2006.01); G06F 1/16 (2006.01); G11C 5/04 (2006.01); H05K 1/11 (2006.01); H01R 13/6464 (2011.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
G06F 1/16 (2013.01); G11C 5/04 (2013.01); G11C 5/06 (2013.01); G11C 5/063 (2013.01); H01R 13/6464 (2013.01); H05K 1/0231 (2013.01); H05K 1/117 (2013.01); H05K 1/141 (2013.01); H05K 1/162 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10189 (2013.01);
Abstract

One embodiment provides an apparatus. The apparatus includes a dual in-line memory module (DIMM). The DIMM includes at least one memory module integrated circuit (IC); a DIMM printed circuit board (PCB); a plurality of DIMM PCB contacts; and a capacitive structure. Each DIMM PCB contact is to couple the memory module IC to a respective DIMM connector pin. The capacitive structure is to provide a mutual capacitance between a first DIMM connector signal pin and a second DIMM connector signal pin.

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Zhang, Zhichao. (2019). Capacitive structures for crosstalk reduction (U.S. Patent No. 10317932). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10317932

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