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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10312135 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Oct. 08, 2014

Combined wafer production method with laser treatment and temperature-induced stresses

Applicant:

Siltectra, Gmbh, Dresden, DE;

Inventors:

Wolfram Drescher, Dresden, DE;

Jan Richter, Dresden, DE;

Christian Beyer, Freiberg, DE;

Assignee:

Siltectra, GmbH, Dresden, DE;

Attorney:

Great Lakes Intellectual Property, PLLC

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/762 (2006.01); B23K 26/359 (2014.01); H01L 31/18 (2006.01); B28D 5/00 (2006.01); H01L 21/268 (2006.01); H01L 21/02 (2006.01); B23K 26/40 (2014.01); B23K 26/0622 (2014.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); B23K 26/53 (2014.01); B23K 26/00 (2014.01); C30B 33/06 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76259 (2013.01); B23K 26/0624 (2015.10); B23K 26/359 (2015.10); B23K 26/40 (2013.01); B23K 26/53 (2015.10); B28D 5/0005 (2013.01); B28D 5/0011 (2013.01); H01L 21/02002 (2013.01); H01L 21/268 (2013.01); H01L 21/76254 (2013.01); H01L 23/544 (2013.01); H01L 23/562 (2013.01); H01L 31/1892 (2013.01); H01L 31/1896 (2013.01); B23K 26/0006 (2013.01); B23K 2103/50 (2018.08); B23K 2103/56 (2018.08); C30B 33/06 (2013.01); H01L 2223/5446 (2013.01); Y02E 10/50 (2013.01);
Abstract

A method for the production of layers of solid material is contemplated. The method may include the steps of providing a solid body for the separation of at least one layer of solid material, generating defects by means of at least one radiation source, in particular a laser, in the inner structure of the solid body in order to determine a detachment plane along which the layer of solid material is separated from the solid body, and applying heat to a polymer layer disposed on the solid body in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the layer of solid material from the solid body.

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