The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Aug. 10, 2016
Applicant:

Lam Research Ag, Villach, AT;

Inventors:

Hongbo Si, San Jose, CA (US);

Bridget Hill, Villach, AT;

Butch Berney, Pleasanton, CA (US);

Daniel Brien, Villach, AT;

Assignee:

LAM RESEARCH AG, Villach, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01); F26B 3/30 (2006.01); H01L 21/67 (2006.01); H05B 3/00 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); H01L 21/67034 (2013.01); H01L 21/67051 (2013.01); H01L 21/68728 (2013.01); H01L 21/68792 (2013.01); H05B 3/0047 (2013.01);
Abstract

An apparatus for processing wafer-shaped articles includes a rotary chuck adapted to hold a wafer-shaped article of a predetermined diameter thereon. A radiant heating plate faces a wafer-shaped article when positioned on the rotary chuck. The radiant heating plate includes radiant heating elements, but a central region of the radiant heating plate is free of radiant heating elements. The radiant heating plate further includes at least one refraction element that refracts radiation emitted by the radiant heating elements and passed through the at least one refraction element, toward the central region of the radiant heating plate.


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