The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2019

Filed:

Jun. 16, 2015
Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Min-Soo Kim, Suwon-si, KR;

Hyun-Ji Song, Suwon-si, KR;

Sun-Hae Kang, Suwon-si, KR;

Sung-Min Kim, Suwon-si, KR;

Sung-Hwan Kim, Suwon-si, KR;

Young-Min Kim, Suwon-si, KR;

Yun-Jun Kim, Suwon-si, KR;

Hea-Jung Kim, Suwon-si, KR;

Youn-Hee Nam, Suwon-si, KR;

Jae-Yeol Baek, Suwon-si, KR;

Byeri Yoon, Suwon-si, KR;

Yong-Woon Yoon, Suwon-si, KR;

Chung-Heon Lee, Suwon-si, KR;

Seulgi Jeong, Suwon-si, KR;

Yeon-Hee Jo, Suwon-si, KR;

Seung-Hee Hong, Suwon-si, KR;

Sun-Min Hwang, Suwon-si, KR;

Won-Jong Hwang, Suwon-si, KR;

Songse Yi, Suwon-si, KR;

MyeongKoo Kim, Suwon-si, KR;

Naery Yu, Suwon-si, KR;

Assignee:

SAMSUNG SDI CO., LTD., Yongin-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/40 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); C08G 10/00 (2006.01); C08G 12/00 (2006.01); C08G 73/06 (2006.01); C08G 61/02 (2006.01); C08G 61/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02118 (2013.01); C08G 10/00 (2013.01); C08G 12/00 (2013.01); C08G 73/0672 (2013.01); G03F 7/40 (2013.01); H01L 21/02282 (2013.01); H01L 21/0332 (2013.01); H01L 21/31058 (2013.01); H01L 21/31133 (2013.01); C08G 61/02 (2013.01); C08G 61/12 (2013.01); C08G 61/122 (2013.01); C08G 61/124 (2013.01); C08G 2261/124 (2013.01); C08G 2261/135 (2013.01); C08G 2261/1422 (2013.01); C08G 2261/314 (2013.01); C08G 2261/3142 (2013.01); C08G 2261/3221 (2013.01); C08G 2261/3241 (2013.01); C08G 2261/344 (2013.01); C08G 2261/3424 (2013.01); C08G 2261/76 (2013.01); C08G 2261/90 (2013.01);
Abstract

A method of producing a layer structure includes forming a first organic layer by applying a first composition including an organic compound on a substrate having a plurality of patterns, applying a solvent on the first organic layer to remove a part of the first organic layer, and applying a second composition including an organic compound on a remaining part of the first organic layer and forming a second organic layer through a curing process.


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