The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2019
Filed:
Jan. 17, 2017
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Japan Electronic Materials Corporation, Amagasaki-shi, Hyogo, JP;
Yuichiro Shimizu, Nagano, JP;
Kosuke Fujihara, Nagano, JP;
Katsunori Yamagishi, Nagano, JP;
Koji Nagai, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;
JAPAN ELECTRONIC MATERIALS CORPORATION, Amagasaki-Shi, JP;
Abstract
A probe guide plate includes a first silicon substrate, a first recess portion formed in an upper surface of the first silicon substrate, first through-holes formed in the first silicon substrate at a bottom of the first recess portion, a second silicon substrate directly bonded on the first silicon substrate, a second recess portion formed to face the first recess portion in a lower surface of the second silicon substrate, and second through-holes formed in the second silicon substrate at a bottom of the second recess portion and arranged to correspond to the first through-holes, A notch portion is formed at an upper end portion of an inner wall of each of the first through-holes of the first silicon substrate.