The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Dec. 20, 2017
Powertech Technology Inc., Hsinchu County, TW;
Hsing-Te Chung, Hsinchu County, TW;
Yong-Cheng Chuang, Hsinchu County, TW;
Kuo-Ting Lin, Hsinchu County, TW;
Nan-Chun Lin, Hsinchu County, TW;
Powertech Technology Inc., Hsinchu County, TW;
Abstract
A manufacturing method of a package structure is provided. The method includes the following steps. A package panel is provided. The package panel includes a first encapsulation, a plurality of first integrated circuit components and a plurality of redistribution circuit patterns electrically connected to the first integrated circuit components, the first integrated circuit components are encapsulated by the first encapsulation, and the redistribution circuit patterns are distributed on the first encapsulation and the first integrated circuit components. The first encapsulation of the package panel is cut to form a plurality of singulated package strips. One of the singulated package strips is attached onto an attachment region of a substrate. The substrate includes at least one tooling hole distributed outside of the attachment region. The package process is performed over the singulated package strip with the substrate affixed through the tooling hole to form the package structure.