The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Nov. 29, 2016
Shin-etsu Handotai Co., Ltd., Tokyo, JP;
SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;
Abstract
A polishing method including polishing to polish a surface of a wafer by sliding the wafer held by a polishing head on a surface of a polishing pad while supplying a polishing slurry to the polishing pad attached to a turntable, the method including correlation derivation to obtain a correlation between a surface temperature of the polishing pad and a haze level of a wafer polished with the use of the polishing pad in advance before performing the polishing, and also the wafer is polished in the polishing while controlling the surface temperature of the polishing pad based on the correlation between the surface temperature of the polishing pad and the haze level of the wafer polished with the use of the polishing pad. Consequently, the polishing method can control a haze in polishing a wafer and thereby prolong the service life of the polishing pad.