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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10297500 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Dec. 15, 2016

Semiconductor wafer dicing method

Applicant:

Nexperia B.v., Nijmegen, NL;

Inventors:

Crispulo Estira Lictao, Jr., Laguna, PH;

Pitak Seantumpol, Bangkok, TH;

Siriluck Wongratanaporngoorn, Bangkok, TH;

Matthew Mondala Fernandez, Cabuyao, PH;

Amileth Dejan Cabrera, Cabuyao, PH;

Assignee:

Nexperia B.V., Nijmegen, NL;

Attorney:

Ohlandt, Greeley, Ruggiero & Perle, L.L.P.

Primary Examiner:

Marcos D Pizarro

Assistant Examiner:

Lawrence C Tynes, Jr

Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/3213 (2006.01); H01L 21/78 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/3043 (2013.01);
Abstract

A method of dicing a bowed or warped semiconductor wafer includes cutting along the saw streets in a first direction on a first half of the wafer, where the first direction is parallel to the bowing, cutting along the saw streets in the first direction on a second half of the wafer opposite to the first half, and step-cutting along the saw streets in the second direction, such that all of the dies are separated from each other, and the sides of the die in the bowing direction are flat and the sides of the die perpendicular to the bowing direction are stepped.

Find Patent Forward Citations

Lictao, Jr., Crispulo. (2019). Semiconductor wafer dicing method (U.S. Patent No. 10297500). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10297500

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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