The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Aug. 29, 2012
Applicants:

Dongsub Choi, Yongin, KR;

David Tien, Santa Clara, CA (US);

Inventors:

Dongsub Choi, Yongin, KR;

David Tien, Santa Clara, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 13/02 (2006.01); G05B 19/418 (2006.01); G05B 13/04 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G05B 13/04 (2013.01); G05B 2219/32018 (2013.01); G05B 2219/32191 (2013.01); G05B 2219/42001 (2013.01); G05B 2219/45031 (2013.01); Y02P 90/22 (2015.11);
Abstract

The invention may be embodied in a system and method for monitoring and controlling feedback control in a manufacturing process, such as an integrated circuit fabrication process. The process control parameters may include translation, rotation, magnification, dose and focus applied by a photolithographic scanner or stepper operating on silicon wafers. Overlay errors are used to compute measured parameters used in the feedback control process. Statistical parameters are computed, normalized and graphed on a common set of axes for at-a-glance comparison of measured parameters and process control parameters to facilitate the detection of problematic parameters. Parameter trends and context relaxation scenarios are also compared graphically. Feedback control parameters, such as EWMA lambdas, may be determined and used as feedback parameters for refining the APC model that computes adjustments to the process control parameters based on the measured parameters.


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