The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Mar. 20, 2015
Applicant:

Entegris, Inc., Billerica, MA (US);

Inventors:

Andrew Galpin, Westford, MA (US);

Daniel Wells, Lowell, MA (US);

Assignee:

Entegris, Inc., Billerica, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/00 (2006.01); B24B 53/017 (2012.01); B24D 5/06 (2006.01); B24B 37/20 (2012.01); B24B 53/12 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24B 37/20 (2013.01); B24D 5/06 (2013.01); B24B 53/12 (2013.01); B24D 2203/00 (2013.01); H01L 21/30625 (2013.01);
Abstract

A CMP pad conditioner for conditioning a polishing pad. Various embodiments of the disclosure include a plurality of elongated protrusions which work a conditioned surface of a polishing pad at a variety of attack angles as the CMP pad conditioner engages the polishing pad. Because of the elongated geometry of the protrusions, the variety of attack angles will tend to flex the conditioned face of the polishing pad in a multifaceted manner. Such multifaceted manipulation of the conditioned face enhances the cut rate of the conditioner assembly and the removal of debris in the pores of the polishing pad that are residual from the CMP process, to better open the pores of the polishing pad and to better maintain the removal rate in the CMP process.


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