The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Oct. 30, 2015
Applicants:

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;

Garuda Technology Co., Ltd., New Taipei, TW;

Inventors:

Xian-Qin Hu, Qinhuangdao, CN;

Yan-Lu Li, Qinhuangdao, CN;

Li-Bo Zhang, Qinhuangdao, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); H05K 3/4623 (2013.01); H05K 3/4688 (2013.01); H05K 1/115 (2013.01); H05K 3/4015 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10303 (2013.01); H05K 2203/061 (2013.01);
Abstract

The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.


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