The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Nov. 11, 2015
Applicant:

Novellus Systems, Inc., Fremont, CA (US);

Inventors:

Dengliang Yang, Union City, CA (US);

Kwame Eason, East Palo Alto, CA (US);

Faisal Yaqoob, Fremont, CA (US);

Joon Hong Park, Dublin, CA (US);

Assignee:

Novellus Systems, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 21/02 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66545 (2013.01); H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); H01L 21/02068 (2013.01); H01L 21/32137 (2013.01); H01L 21/6831 (2013.01);
Abstract

Provided are methods and apparatuses for removing a polysilicon layer on a wafer, where the wafer can include a nitride layer, a low-k dielectric layer, an oxide layer, and other films. A plasma of a hydrogen-based species and a fluorine-based species is generated in a remote plasma source, and the wafer is exposed to the plasma at a relatively low temperature to limit the formation of solid byproduct. In some implementations, the wafer is maintained at a temperature below about 60° C. The polysilicon layer is removed at a very high etch rate, and the selectivity of polysilicon over the nitride layer and the oxide layer is very high. In some implementations, the wafer is supported on a wafer support having a plurality of thermal zones configured to define a plurality of different temperatures across the wafer.


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