The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Sep. 07, 2017
United Microelectronics Corp., Hsin-Chu, TW;
Chia Chang Hsu, Kaohsiung, TW;
Chun-Hsien Lin, Tainan, TW;
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Abstract
A method for fabricating a semiconductor device is provided. A substrate having a dummy gate thereon is prepared. A spacer is disposed on a sidewall of the dummy gate. A source/drain region is disposed adjacent to the dummy gate. A sacrificial layer is then formed on the source/drain region. A cap layer is then formed on the sacrificial layer. A top surface of the cap layer is coplanar with a top surface of the dummy gate. A replacement metal gate (RMG) process is performed to transform the dummy gate into a replacement metal gate. An opening is then formed in the cap layer to expose a top surface of the sacrificial layer. The sacrificial layer is removed through the opening, thereby forming a lower contact hole exposing a top surface of the source/drain region. A lower contact plug is then formed in the lower contact hole.