The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Mar. 29, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Mitsuhiro Okada, Nirasaki, JP;

Satoshi Takagi, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/768 (2006.01); C23C 16/02 (2006.01); C23C 16/04 (2006.01); C23C 16/24 (2006.01); C23C 16/52 (2006.01); C23C 16/455 (2006.01); C23C 16/44 (2006.01); H01L 21/3205 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76882 (2013.01); C23C 16/0272 (2013.01); C23C 16/045 (2013.01); C23C 16/24 (2013.01); C23C 16/4412 (2013.01); C23C 16/45523 (2013.01); C23C 16/52 (2013.01); H01L 21/32055 (2013.01); H01L 21/32135 (2013.01); H01L 21/76802 (2013.01); H01L 21/76879 (2013.01);
Abstract

A silicon film forming method of forming a silicon film in a recess with respect to a target substrate having on its surface an insulating film in which the recess is formed. The method includes (a) forming a first silicon film filling the recess by supplying a Silicon raw material gas onto the target substrate, (b) subsequently, etching the first silicon film by supplying a halogen-containing etching gas onto the target substrate such that surfaces of the insulating film on the target substrate and on an upper portion of an inner wall of the recess are exposed and such that the first silicon film remains in a bottom portion of the recess, and (c) subsequently, growing a second silicon film in a bottom-up growth manner on the first silicon film that remains in the recess by supplying a Silicon raw material gas onto the target substrate after the etching.


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