The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Dec. 05, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Meng-Tse Chen, Pingtung County, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Chih-Wei Lin, Hsinchu County, TW;
Sheng-Hsiang Chiu, Tainan, TW;
Yao-Tong Lai, Yilan County, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
An integrated fan-out (InFO) package includes at least one die, a plurality of conductive structures, an encapsulant, an enhancement layer, and a redistribution structure. The die has an active surface and includes a plurality of conductive posts on the active surface. The conductive structures surround the die. The encapsulant partially encapsulates the die. The enhancement layer is over the encapsulant. A top surface of the enhancement layer is substantially coplanar with top surfaces of the conductive posts and the conductive structures. A material of the enhancement layer is different from a material of the encapsulant. A roughness of an interface between the encapsulant and the enhancement layer is larger than a roughness of the top surface of the enhancement layer. The redistribution structure is over the enhancement layer and is electrically connected to the conductive structures and the die.