The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Sep. 29, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Xiangjin Xie, Fremont, CA (US);

Feng Q. Liu, San Jose, CA (US);

Daping Yao, Portland, OR (US);

Alexander Jansen, Sunnyvale, CA (US);

Joung Joo Lee, San Jose, CA (US);

Adolph Miller Allen, Oakland, CA (US);

Xianmin Tang, San Jose, CA (US);

Mei Chang, Saratoga, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B08B 7/00 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); B08B 5/00 (2006.01); B08B 9/027 (2006.01); B08B 3/00 (2006.01); B08B 9/00 (2006.01); B08B 3/10 (2006.01); C23G 1/24 (2006.01); F01D 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02068 (2013.01); B08B 5/00 (2013.01); B08B 7/0035 (2013.01); B08B 9/027 (2013.01); H01L 21/02063 (2013.01); H01L 21/76814 (2013.01); B08B 3/00 (2013.01); B08B 3/106 (2013.01); B08B 9/00 (2013.01); C23G 1/24 (2013.01); F01D 5/005 (2013.01); F05D 2230/90 (2013.01);
Abstract

Methods for processing a substrate are provided herein. In some embodiments, a method of processing a substrate includes: heating a substrate disposed within a processing volume of a substrate processing chamber to a temperature of up to about 400 degrees Celsius, wherein the substrate comprises a first surface, an opposing second surface, and an opening formed in the first surface and extending towards the opposing second surface, and wherein the second surface comprises a conductive material disposed in the second surface and aligned with the opening; and exposing the substrate to a process gas comprising about 80 to about 100 wt. % of an alcohol to reduce a contaminated surface of the conductive material.


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