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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10280107 B1

PDFFull Text
Date of Patent:
May. 07, 2019

Filed:

Jun. 23, 2016

Method for guiding a crack in the peripheral region of a donor substrate

Applicant:

Siltectra Gmbh, Dresden, DE;

Inventors:

Marko Swoboda, Dresden, DE;

Christian Beyer, Dresden, DE;

Franz Schilling, Dresden, DE;

Jan Richter, Dresden, DE;

Assignee:

Siltectra, Gmbh, Dresden, DE;

Attorney:

Great Lakes Intellectual Property, PLLC

Primary Examiner:

Tucker J Wright

Assistant Examiner:

Wilner Jean Baptiste

Int. Cl.
CPC ...
H01L 21/268 (2006.01); H01L 21/304 (2006.01); C03B 33/02 (2006.01); B23K 26/00 (2014.01); B28D 1/22 (2006.01); B28D 5/00 (2006.01); C03B 33/09 (2006.01); B23K 26/359 (2014.01); B23K 26/70 (2014.01); B23K 26/53 (2014.01); B23K 26/0622 (2014.01); B23K 26/60 (2014.01); H01L 21/02 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
C03B 33/0222 (2013.01); B23K 26/0006 (2013.01); B23K 26/0624 (2015.10); B23K 26/359 (2015.10); B23K 26/53 (2015.10); B23K 26/60 (2015.10); B23K 26/702 (2015.10); B28D 1/221 (2013.01); B28D 5/0005 (2013.01); C03B 33/091 (2013.01); H01L 21/02005 (2013.01); H01L 21/268 (2013.01); H01L 21/304 (2013.01); B23K 2101/40 (2018.08);
Abstract

The present invention relates to a method for separating solid-body slices () from a donor substrate (). The method comprises the steps of: producing modifications () within the donor substrate () by means of laser beams (), wherein a detachment region is predefined by the modifications (), along which detachment region the solid-body layer () is separated from the donor substrate (), and removing material from the donor substrate (), starting from a surface () extending in the peripheral direction of the donor substrate (), in the direction of the center (Z) of the donor substrate (), in particular in order to produce a peripheral indentation ().

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