The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Feb. 10, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Tsung-Hsing Yu, Taipei, TW;

Chia-Wen Liu, Taipei, TW;

Yeh Hsu, Taoyuan County, TW;

Jean-Pierre Colinge, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/775 (2006.01); H01L 21/20 (2006.01); H01L 21/36 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1037 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); H01L 29/0676 (2013.01); H01L 29/0873 (2013.01); H01L 29/42376 (2013.01); H01L 29/66439 (2013.01); H01L 29/66666 (2013.01); H01L 29/775 (2013.01);
Abstract

A semiconductor device having a channel formed from a nanowire with a multi-dimensional diameter is provided. The semiconductor device comprises a drain region formed on a semiconductor substrate. The semiconductor device further comprises a nanowire structure formed between a source region and the drain region. The nanowire structure has a first diameter section joined with a second diameter section. The first diameter section is coupled to the drain region and has a diameter greater than the diameter of the second diameter section. The second diameter section is coupled to the source region. The semiconductor device further comprises a gate region formed around the junction at which the first diameter section and the second diameter section are joined.


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