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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10276413 B1

PDFFull Text
Date of Patent:
Apr. 30, 2019

Filed:

Apr. 03, 2015

Laser processing apparatus

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Chikara Aikawa, Tokyo, JP;

Yuki Ogawa, Tokyo, JP;

Hirokazu Matsumoto, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain, Ltd.

Primary Examiner:

Ibrahime A Abraham

Assistant Examiner:

Chris Q Liu

Int. Cl.
CPC ...
B23K 26/16 (2006.01); B23K 26/03 (2006.01); B23K 26/06 (2014.01); B23K 26/14 (2014.01); B23K 26/142 (2014.01); B23K 26/08 (2014.01); H01L 21/67 (2006.01); B23K 26/364 (2014.01); B23K 26/0622 (2014.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); B23K 26/032 (2013.01); B23K 26/0622 (2015.10); B23K 26/0648 (2013.01); B23K 26/0853 (2013.01); B23K 26/0876 (2013.01); B23K 26/142 (2015.10); B23K 26/1476 (2013.01); B23K 26/16 (2013.01); B23K 26/364 (2015.10); H01L 21/67092 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08);
Abstract

A laser processing apparatus includes a melt processing unit for processing a melt formed by laser processing, the melt processing unit being disposed downstream of a condenser in a laser beam irradiating direction. The melt processing unit includes a gas injecting section having an opening allowing the passage of a laser beam applied from the condenser, the gas injecting section injecting high-speed gas from the opening to a workpiece, and a melt sucking section having a suction port disposed so as to surround the opening of the gas injecting section, the suction port sucking the melt scattered by the high-speed gas injected from the opening. The gas injecting section is connected to high-pressure gas supply source, and the melt sucking section is connected to melt sucking unit.

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