The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
May. 16, 2017
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd, Hsinchu, TW;
Inventors:
Jiun-Yu Lai, Taipei, TW;
Ying-Hsiu Tsai, Hsinchu, TW;
Wei-Chen Chang, Nantou, TW;
Yi-Ching Chiou, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/10 (2006.01); B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 49/105 (2013.01); B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 53/017 (2013.01);
Abstract
Polishing systems and methods for polishing a substrate are provided. The method includes polishing a substrate using a polishing pad and monitoring a thickness of the polishing pad. The monitoring of the thickness of the polishing pad is performed by detecting an eddy current generated from a conductor element below a bottom surface of the polishing pad. The method also includes replacing the polishing pad with a second polishing pad if the thickness of the polishing pad is smaller than a predetermined value.