The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Jan. 24, 2018
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Chun-Liang Kuo, Kaohsiung, TW;

Tsang-Hsuan Wang, Kaohsiung, TW;

Yu-Ming Hsu, Changhua County, TW;

Tsung-Mu Yang, Tainan, TW;

Ching-I Li, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 27/11 (2006.01); H01L 27/088 (2006.01); H01L 29/08 (2006.01); H01L 29/16 (2006.01); H01L 29/24 (2006.01); H01L 21/8234 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 29/6656 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02167 (2013.01); H01L 21/02326 (2013.01); H01L 21/02521 (2013.01); H01L 21/02529 (2013.01); H01L 21/31116 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 27/0886 (2013.01); H01L 27/1104 (2013.01); H01L 27/1116 (2013.01); H01L 29/0847 (2013.01); H01L 29/1608 (2013.01); H01L 29/24 (2013.01); H01L 29/66545 (2013.01); H01L 29/7848 (2013.01);
Abstract

A FinFET device includes a substrate, first and second fins, first and second gates and first and second epitaxial layers. The substrate has a first region and a second region. The first and second fins are on the substrate respectively in the first and second regions. In an embodiment, the number of the first fins is different from the number of the second fins. The first and second gates are on the substrate and respectively across the first and second fins. The first epitaxial layers are disposed in first recesses of the first fins adjacent to the first gate. The second epitaxial layers are disposed in second recesses of the second fins adjacent to the second gate. In an embodiment, the maximum width of the first epitaxial layers is L1, the maximum width of the second epitaxial layers is L2, and (L2−L1)/L1 is equal to or less than about 1%.


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