The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Jun. 30, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chin-Yu Ku, Hsinchu, TW;

Chien-Chih Chou, New Taipei, TW;

Chen-Shien Chen, Hsinchu, TW;

Hon-Lin Huang, Hsinchu, TW;

Chi-Cheng Chen, Tainan, TW;

Kuang-Yi Wu, Changhua, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 23/522 (2013.01); H01L 24/13 (2013.01); H01L 2924/1206 (2013.01);
Abstract

Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor device includes an inductor structure, and the inductor structure is on a substrate and includes a first metal layer, a magnetic stack, a polymer layer and a second metal layer. The first metal layer is over the substrate. The magnetic stack is over the first metal layer and has a substantially zigzag shaped sidewall. The polymer layer is over the first metal layer and encapsulates the magnetic stack. The second metal layer is over the polymer layer.


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Ku, Chin-Yu. (2019). Semiconductor devices and methods of forming the same (U.S. Patent No. 10263064). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10263064

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