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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10262877 B1

PDFFull Text
Expired
Date of Patent:
Apr. 16, 2019

Filed:

Mar. 13, 2017

Apparatus and method for reducing substrate sliding in process chambers

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sriskantharajah Thirunavukarasu, Singapore, SG;

Kirankumar Savandaiah, Bangalore, IN;

Cheng-Hsiung Tsai, Cupertino, CA (US);

Kai Liang Liew, Singapore, SG;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:

Moser Taboada

Alan Taboada

Primary Examiner:

Jiong-Ping Liu

Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/306 (2006.01); C23C 16/50 (2006.01); C23C 14/50 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01); H01L 21/683 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67069 (2013.01); C23C 14/50 (2013.01); C23C 16/458 (2013.01); C23C 16/4586 (2013.01); C23C 16/50 (2013.01); H01J 37/32009 (2013.01); H01J 37/32082 (2013.01); H01J 37/32577 (2013.01); H01J 37/3405 (2013.01); H01L 21/306 (2013.01); H01L 21/67103 (2013.01); H01L 21/6833 (2013.01); H01L 21/68742 (2013.01); H01L 21/68757 (2013.01); H01J 2237/334 (2013.01); H01J 2237/3321 (2013.01);
Abstract

Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.

Find Patent Forward Citations

Thirunavukarasu, Sriskantharajah. (2019). Apparatus and method for reducing substrate sliding in process chambers (U.S. Patent No. 10262877). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10262877

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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